Hermetic packaging is becoming an essential sealing practice in the electronics industry. It seals an object airtight to prevent the pass-through of oxygen, dust particles, water vapor, and other contaminants. Hermetic electronic packaging protects the electronics from changes in pressure, humidity, temperature, vibration, shock, or any other natural hazard. However, picking the right hermetically sealed packaging for electronic components and devices requires many considerations. Therefore, this article explores the top three factors to help you choose the right hermetic packaging for your business.
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The Selection Guide for Hermetic Packaging
Hermetic seals are the packaging seals that ensure the correct and safe functionality of a wide range of electronics. They are used in various applications such as aerospace technologies, telecommunication, implantable medical devices, optical devices, automotive, and similar others.
The main difference between hermetic and non-hermetic packaging is that hermetic seals make an object airtight, while non-hermetic seals are made from materials with higher gas/moisture permeability. Moreover, hermetic packages are more rigid and provide superior protection against environmental factors compared to non-hermetic packages.
Why Use Hermetic Packaging
Electronics continuously get exposed to various environmental conditions that can deteriorate their performance or damage them entirely. For instance, when electronic components and devices are exposed to moisture, it can lead to corrosion in metal parts and PCBs,which can cause short circuits or complete device failure. Besides, moisture can also lead to conductivity changes, gradual material degradation, and performance inconsistency.
However, when electronic components and devices are sealed with hermetic packaging made from aluminum cans, glass, metal foils, or gas-impermeable plastics, they get completely isolated from moisture, dust particles, and other contaminants. Moreover, hermetic packages can withstand higher pressure and tough usage conditions. This way, hermetic electronic packaging leads to improved performance, enhanced reliability, and prolonged lifespan of enclosed electronics.
How to Choose Hermetic Packaging
In order to ensure the integrity and functionality of electronics, it is crucial to choose the right hermetic packaging. Therefore, below are the top 3 factors to consider while selecting hermetic packaging:
1. Common Constructions of Hermetic Packaging
Different manufacturers use different approaches to construct hermetic packaging. The common ones are as follows:
i. Multi-layer Ceramic Packages:
These packages are made of multiple layers of ceramic material, which are metalized, coated, and fired to form the body. Afterward, leads are fused to the body. These packages increase electrical insulation, reduce inductance, and enhance resistance to extreme environmental conditions.
ii. Pressed Ceramic Packages:
These packages comprise three construction parts, i.e., base, lid, and leadframe. The base and lid are formed by pressing ceramic powder into the targeted shape and firing it, with glass subsequently screened onto the fired base and lid. In addition, a leadframe is implanted into the base glass during assembly, and the hermetic seal is achieved by melting the lid glass over the base and lead frame. These packages are lower in cost and provide resistance to moisture but feature fewer enhancements compared to multi-layer ceramic packages.
iii. Metal Can Packages:
These packages involve metal bases such as steel or aluminum. After packaging a metal base, a can (or metal lid) gets welded around the base to achieve the hermetic seal. These packages best suit linear/hybrid applications and offer durability and mechanical protection.
iv. Hermetic Package Configuration:
It refers to the arrangement and configuration of the hermetic packaging. It involves factors like assembly approach, size, pins length, thinness, gaps, etc. The configuration varies from manufacturer to manufacturer, so it must be considered according to the requirements of the electronics.
2. Assembly Approaches
There are multiple approaches to assembling hermetic packages. The two common ones are as follows:
i. Through Hole Technology (THT):
It involves inserting component leads through holes in the package and then soldering them on the opposite side. This assembly approach is best suited for electronic components with larger pin sizes or devices that require high mechanical strength.
ii. Surface Mount Technology (SMT):
It involves mounting components directly on the package surface. This assembly approach is best suited for electronic components with smaller sizes or devices with compact designs and efficient space utilization.
3. Size
The size of the hermetic packages is directly linked with their functionality. A hermetic seal should fit tightly with the electronics to ensure complete protection. The other aspects to consider related to size are as follows:
i. Pins Length and Gaps:
Evaluate the length of the package pins and the gaps between them to ensure that the enclosed electronics can have proper connections and that additional wiring can be accommodated.
ii. Thin:
Consider a thin hermetic package, as it provides an optimal way of transferring heat away from the enclosed electronics, which reduces the chance of overheating.
Conclusion
Most electronic components and devices today require hermetic seals, especially those in high-reliability applications, sensors, etc. But choosing the right hermetically sealed packaging for your products is equally important. Therefore, consider the above factors to find the right hermetic packaging solution. However, if you don’t want to go through the above checks, Hermetix is the best choice fort customized and high-quality hermetic packaging solutions.
Hermetix is a leading metal packaging manufacturer of hermetic packages. With over 25 years of experience, extensive industrial microelectronic packaging knowledge, and state-of-the-art processes and technologies, Hermetix provides the best-in-class, customized hermetic packaging solutions for any size or type of products in a highly cost-effective way.
Today, Hermetix is providing an extensive product category, from optoelectronic, power, and sensor packages to HIC, SMD, and TO package solutions. The company’s hermetic packages find application in various fields, such as optical communication, medical equipment, sensors, automobile, commercial lasers, aviation, and more.
Besides the rich set of hermetic solutions, Hermetix’s in-house engineers can also help resolve design issues and provide material suggestions. In short, Hermetix is a one-stop place to fulfill your simple to complex hermetic packaging needs in a highly reliable and cost-friendly way.
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